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W25N01GVZEIG/TRAY

产品分类: 闪存(Flash)
厂牌: WINBOND/台湾华邦
产品描述: 128MB 2.7V 35mA 3.6V Serial (SPI,Dual SPI,Quad SPI) 贴片安装 6mm*8mm*730μm
供应商型号:
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标准整包数: 0
WINBOND/台湾华邦 闪存(Flash) W25N01GVZEIG/TRAY

W25N01GVZEIG/TRAY概述

    # W25N01GV 1G-bit Serial SLC NAND Flash Memory
    Product Introduction
    The W25N01GV, released by Winbond Electronics, is a 1G-bit serial Single-Level Cell (SLC) NAND flash memory designed for applications requiring high density storage in compact spaces. This device combines the efficiency of the SPI interface with the robustness of NAND technology, making it ideal for systems where pin count, power consumption, and space are critical factors. It supports both Dual and Quad SPI modes, enabling high-speed data transfer. Its primary functions include code shadowing, direct execution from flash (XIP), and bulk storage for text, voice, and data.
    Applications:
    - Code shadowing and execution directly from flash.
    - Voice and text storage.
    - High-density data storage in embedded systems.
    - Consumer electronics.
    - Industrial control systems.
    Technical Parameters
    Below are the key technical specifications extracted from the datasheet:
    | Parameter | Specification |

    | Memory Capacity | 1G-bit (128MB) |
    | Voltage Range | 2.7V to 3.6V |
    | Current Consumption | Active: 25mA, Standby: 10µA |
    | Operating Temperature | -40°C to +85°C |
    | Page Size | 2,048 bytes |
    | Total Number of Pages | 65,536 pages |
    | Interface | Dual/Quad SPI and Continuous Read modes |
    | Package Options | 8-pin WSON 8x6-mm and TFBGA (5x5 or 6x4 balls) |
    Additional details include support for bad block management, ECC (Error Correction Code) capabilities, and configuration registers for enhanced functionality.
    Product Features and Advantages
    The W25N01GV offers several distinct features that set it apart in its class:
    1. Compact Design: Space-saving packages such as 8-pin WSON 8x6-mm allow integration into devices with minimal footprint requirements.
    2. Dual/Quad SPI Support: Enhanced data transfer speeds improve performance without increasing pin count.
    3. Low Power Consumption: Minimal active and standby currents make it suitable for battery-operated devices.
    4. Robust Error Handling: Built-in ECC ensures reliable data storage even in challenging environments.
    5. Flexible Configurations: Users can configure protection registers and status registers to suit specific application needs.
    These advantages position the W25N01GV as a competitive choice for developers seeking high-performance, low-power storage solutions.
    Application Case Studies and Usage Recommendations
    Example 1: Embedded Systems
    In embedded systems, the W25N01GV can be used for code shadowing and direct execution from flash. For optimal performance:
    - Ensure proper configuration of the buffer read mode (BUF=1) for continuous data streaming.
    - Use dual or quad SPI modes based on system bandwidth requirements.
    Example 2: Consumer Electronics
    For consumer electronics, this flash memory is ideal for storing firmware updates. Tips for implementation include:
    - Regularly check and update bad block management settings.
    - Implement robust error correction mechanisms to ensure data integrity during firmware updates.
    Compatibility and Support
    The W25N01GV is compatible with various host controllers supporting SPI protocols. Winbond provides comprehensive support through:
    - Datasheets and application notes available on their website.
    - Dedicated customer support for troubleshooting and integration assistance.
    Common Issues and Solutions
    | Issue | Solution |

    | Poor write endurance | Configure write protection bits appropriately.

W25N01GVZEIG/TRAY参数

参数
存储容量 128MB
最大供电电流 35mA
最大时钟频率 -
最大工作供电电压 3.6V
最小工作供电电压 2.7V
组织 -
数据总线宽度 -
接口类型 Serial (SPI,Dual SPI,Quad SPI)
长*宽*高 6mm*8mm*730μm
安装方式 贴片安装
应用等级 工业级

W25N01GVZEIG/TRAY数据手册

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WINBOND/台湾华邦 闪存(Flash) WINBOND/台湾华邦 W25N01GVZEIG/TRAY W25N01GVZEIG/TRAY数据手册

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