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BGM13S32F512GN-V2R

产品分类: 蓝牙芯片
产品描述: 90.2dBm 2Mbps IrDA,I²C,I²S,SPI,UART 贴片安装
供应商型号: SYE-BGM13S32F512GN-V2R
供应商: 海外现货
标准整包数: 1
SILICON LABORATORIES 蓝牙芯片 BGM13S32F512GN-V2R

BGM13S32F512GN-V2R概述

    BGM13S Blue Gecko Bluetooth® SiP Module: Comprehensive Technical Overview
    1. Product Introduction
    The BGM13S Blue Gecko Bluetooth® SiP Module is Silicon Labs' premier System-in-Package (SiP) solution designed to provide advanced Bluetooth 5 connectivity. It supports various physical layer options, including 2 Mbps, 1 Mbps, and coded LE Bluetooth PHYs, ensuring versatile communication capabilities. Equipped with 512 kB of flash memory and 64 kB of RAM, the module is optimized for implementing complex Bluetooth Mesh networks efficiently.
    Primarily targeted at battery-operated devices, the BGM13S also excels in applications requiring compact form factors and low power consumption. The module integrates an ARM® Cortex®-M4 microcontroller operating at 38.4 MHz, enabling robust signal processing and extensive peripheral support, making it a prime choice for wearables, IoT end nodes, industrial systems, and smart accessories.
    2. Technical Parameters
    | Feature | Specification |

    | Processor | 32-bit ARM® Cortex®-M4 @ 38.4 MHz |
    | Memory | 512 kB Flash, 64 kB RAM |
    | Operating Voltage | 1.8 V to 3.8 V |
    | Temperature Range | -40 °C to +85 °C |
    | Dimensions | 6.5 mm × 6.5 mm × 1.4 mm |
    | TX Power | Up to +19 dBm |
    | RX Sensitivity | -94.1 dBm (at 1 Mbps) |
    | Wireless Standard | Bluetooth 5.0, Bluetooth Mesh |
    | Interface | GPIO (32), I2C, USART, Low Energy UART |
    | Regulatory Compliance | FCC, CE/UKCA, IC/ISED, MIC/Telec |
    3. Product Features and Advantages
    The BGM13S leverages cutting-edge technology to deliver superior performance:
    - Bluetooth 5 Compliance: Offers enhanced bandwidth, faster data transfer rates, and longer range.
    - Extensive Peripheral Integration: Supports a wide array of digital and analog peripherals, facilitating versatile system designs.
    - Low Power Consumption: Active mode consumes just 87 µA/MHz, while deep sleep modes (EM2) draw only 1.4 µA.
    - Security Features: Integrated hardware accelerators ensure AES encryption and secure data transmission.
    - Compact Design: Minimal footprint (6.5 × 6.5 mm) simplifies PCB layout for space-constrained applications.
    These advantages make the BGM13S ideal for products targeting IoT, wearable tech, health monitoring, and industrial automation sectors.
    4. Application Case Studies and Usage Tips
    Application Example 1: Wearable Devices
    The BGM13S is well-suited for fitness trackers and smartwatches due to its small size and low power consumption. To optimize performance, designers should:
    - Implement efficient sleep cycles to maximize battery life.
    - Use the integrated RF front-end for built-in antenna solutions to simplify PCB layouts.
    Application Example 2: Home Automation
    For smart thermostats or lighting systems, the BGM13S's robustness and regulatory certifications are critical. Developers can:
    - Utilize the 32 GPIOs for interfacing with multiple sensors.
    - Employ external antennas for optimal RF coverage in larger spaces.
    5. Compatibility and Support
    The BGM13S is compatible with various other components and development tools from Silicon Labs, including:
    - Software development kits (SDKs) for Bluetooth 5.0 and Bluetooth Mesh.
    - Reference designs and layout guidelines to accelerate product prototyping.
    Silicon Labs provides comprehensive support through technical documentation, community forums, and customer service to assist developers throughout the design process.
    6. Common Issues and Solutions
    | Issue

BGM13S32F512GN-V2R参数

参数
最大数据速率 2Mbps
ISM带宽 -
最小工作供电电压 -
支持协议 -
最大工作频率 -
范围 -
典型灵敏度 90.2dBm
最大工作供电电压 -
最小工作频率 -
接口类型 IrDA,I²C,I²S,SPI,UART
安装方式 贴片安装
零件状态 停产
包装方式 卷带包装

BGM13S32F512GN-V2R厂商介绍

Silicon Laboratories(简称SiLabs)是一家全球领先的半导体公司,专注于开发高性能、低功耗的模拟、混合信号和无线微控制器(MCU)产品。公司成立于1996年,总部位于美国德克萨斯州奥斯汀。

SiLabs的主要产品分为以下几类:
1. 微控制器(MCU):包括EFM32、EFR32等系列,广泛应用于物联网(IoT)、智能家居、工业控制等领域。
2. 无线产品:如Zigbee、Thread、Bluetooth、Wi-Fi等无线通信模块,用于智能设备间的无线连接。
3. 模拟和混合信号产品:包括电源管理、音频、接口等芯片,服务于消费电子、医疗、汽车等行业。
4. 开发工具和软件:提供开发板、调试器和软件工具,帮助客户快速开发和测试产品。

SiLabs的优势在于:
1. 高性能:产品具有高性能、低功耗的特点,满足各种严苛的应用需求。
2. 丰富的产品线:提供多种类型的芯片和解决方案,满足不同客户的需求。
3. 强大的技术支持:提供专业的技术支持和培训,帮助客户解决技术难题。
4. 快速响应市场:紧跟市场趋势,快速推出创新产品,满足客户需求。

BGM13S32F512GN-V2R数据手册

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