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BGM13S32F512GN-V3R

产品分类: 无线收发芯片
产品描述: 18dBm 8.9mA Bluetooth 10.5mA GFSK 3.8V 2Mbps IrDA,I²C,I²S,SPI,UART 102.1dBm 1.8V 贴片安装
供应商型号: SYE-BGM13S32F512GN-V3R
供应商: 海外现货
标准整包数: 1
SILICON LABORATORIES 无线收发芯片 BGM13S32F512GN-V3R

BGM13S32F512GN-V3R概述

    BGM13S Blue Gecko Bluetooth® SiP Module Technical Overview
    Product Introduction
    The BGM13S is Silicon Labs' premier System-in-Package (SiP) module designed to provide Bluetooth 5.0 connectivity. Combining advanced hardware capabilities with energy-efficient features, this module supports multiple PHYs, including 2 Mbps, 1 Mbps, and coded LE Bluetooth standards. The BGM13S is equipped with 512 kB of flash memory and 64 kB of RAM, ensuring it meets the memory requirements for Bluetooth Mesh networking. Its compact size (6.5 × 6.5 × 1.4 mm) and robust RF performance make it ideal for a variety of applications, ranging from wearables to industrial automation systems.
    Key areas of application include:
    - Bluetooth Mesh networks
    - IoT end nodes and gateways
    - Health, sports, and wellness devices
    - Home, building, and industrial automation
    - Smart phone, tablet, and PC accessories
    Technical Parameters
    The following table summarizes the critical technical specifications of the BGM13S:
    | Parameter | Value |

    | Operating Voltage | 1.8 V to 3.8 V |
    | Operating Temperature | -40 °C to +85 °C |
    | Flash Memory | 512 kB |
    | RAM | 64 kB |
    | RF Power Output | Up to +19 dBm |
    | Receiver Sensitivity | -94.1 dBm (1 Mbps GFSK) |
    | Dimensions | 6.5 mm × 6.5 mm × 1.4 mm |
    | Number of GPIO Pins | 32 |
    Additional highlights include support for Bluetooth 5, autonomous hardware crypto accelerators, precision low-frequency oscillators, and built-in hardware cryptographic accelerators for AES encryption.
    Product Features and Advantages
    The BGM13S excels with its:
    - Energy Efficiency: Low active mode current (9.7 mA @ 1 Mbps, RX) and deep sleep currents (1.4 µA).
    - Advanced Connectivity: Supports Bluetooth 5 features like 2 Mbps data rate and long-range communication.
    - Secure Environment: Integrated hardware cryptographic accelerators ensure data security.
    - Ease of Integration: Compact footprint simplifies board design and reduces engineering effort.
    These features position the BGM13S as a cost-effective, flexible solution for developers looking to implement Bluetooth 5.0 connectivity in their products.
    Application Case Studies and Usage Recommendations
    The BGM13S is particularly well-suited for wearable devices and IoT endpoints. For example:
    - Wearable Devices: The BGM13S's small form factor and low power consumption make it perfect for smartwatches and fitness trackers.
    - IoT Applications: As a wireless node, the module can communicate with central hubs using Bluetooth Mesh, enabling scalable and robust network solutions.
    Usage Suggestions:
    1. Optimize the PCB layout according to the provided guidelines to maximize antenna efficiency.
    2. Use the energy management features to extend battery life in low-power mode scenarios.
    3. Leverage the crypto accelerators for secure communication in sensitive applications.
    Compatibility and Support
    The BGM13S supports standard protocols like Bluetooth LE and Bluetooth Mesh. It is compatible with development tools and software stacks provided by Silicon Labs, ensuring seamless integration. End-product manufacturers should verify compliance with regional regulatory certifications (e.g., FCC, CE, etc.).
    Silicon Labs offers robust support through official documentation, evaluation kits (SLWRB4305A and SLWRB4305C), and access to experienced engineers.
    Common Issues and Solutions
    Here are some common challenges and practical solutions:
    1. Problem: Low antenna efficiency due to poor PCB layout.
    - Solution: Follow the recommended PCB land patterns and ensure proper grounding and matching components a

BGM13S32F512GN-V3R参数

参数
发送机数量 -
最大工作频率 -
最小工作频率 -
支持协议 -
最大数据速率 2Mbps
接收电流 10.5mA
模块/芯片分类 -
典型供电电流 -
传输电流 8.9mA
最大工作供电电压 3.8V
调制方式 GFSK
典型灵敏度 102.1dBm
最小工作供电电压 1.8V
典型输出功率 18dBm
射频系列/标准 Bluetooth
接收机数量 -
接口类型 IrDA,I²C,I²S,SPI,UART
安装方式 贴片安装
零件状态 在售
包装方式 卷带包装

BGM13S32F512GN-V3R厂商介绍

Silicon Laboratories(简称SiLabs)是一家全球领先的半导体公司,专注于开发高性能、低功耗的模拟、混合信号和无线微控制器(MCU)产品。公司成立于1996年,总部位于美国德克萨斯州奥斯汀。

SiLabs的主要产品分为以下几类:
1. 微控制器(MCU):包括EFM32、EFR32等系列,广泛应用于物联网(IoT)、智能家居、工业控制等领域。
2. 无线产品:如Zigbee、Thread、Bluetooth、Wi-Fi等无线通信模块,用于智能设备间的无线连接。
3. 模拟和混合信号产品:包括电源管理、音频、接口等芯片,服务于消费电子、医疗、汽车等行业。
4. 开发工具和软件:提供开发板、调试器和软件工具,帮助客户快速开发和测试产品。

SiLabs的优势在于:
1. 高性能:产品具有高性能、低功耗的特点,满足各种严苛的应用需求。
2. 丰富的产品线:提供多种类型的芯片和解决方案,满足不同客户的需求。
3. 强大的技术支持:提供专业的技术支持和培训,帮助客户解决技术难题。
4. 快速响应市场:紧跟市场趋势,快速推出创新产品,满足客户需求。

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