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BGM13S22F512GN-V3R

产品分类: 无线收发芯片
产品描述: 8dBm 8.9mA Bluetooth 10.5mA GFSK 3.8V 2Mbps IrDA,I²C,I²S,SPI,UART 102.1dBm 1.8V SMD-51P 贴片安装
供应商型号: SYE-BGM13S22F512GN-V3R
供应商: 海外现货
标准整包数: 1
SILICON LABORATORIES 无线收发芯片 BGM13S22F512GN-V3R

BGM13S22F512GN-V3R概述

    BGM13S Blue Gecko Bluetooth® SiP Module Technical Overview
    Product Introduction
    The BGM13S is Silicon Labs' first System-in-Package (SiP) module solution designed to offer Bluetooth 5 connectivity. This compact module integrates a high-performance 32-bit ARM Cortex®-M4 microcontroller with extensive peripheral features, making it ideal for a variety of applications requiring low power consumption, robust RF performance, and easy integration into existing products.
    The module supports Bluetooth 5 protocols, including Bluetooth Mesh networking, with enhanced data rates and long-range communication capabilities. Its primary applications span wearables, IoT end nodes, health monitoring, industrial automation, and smart accessories.
    Technical Parameters
    | Parameter | Value |

    | Operating Voltage | 1.8 V to 3.8 V |
    | Operating Temperature | -40 °C to +85 °C |
    | Dimensions | 6.5 mm × 6.5 mm × 1.4 mm |
    | Flash Memory | 512 kB |
    | RAM | 64 kB |
    | GPIO Pins | 32 |
    | TX Power | Up to +19 dBm |
    | RX Sensitivity | -94.1 dBm @ 1 Mbps |
    | Key Protocols | Bluetooth 5, Bluetooth Mesh |
    | Regulatory Certifications | FCC, CE, IC, MIC, Telec |
    Product Features and Advantages
    1. Low Power Consumption: The BGM13S boasts advanced power management with multiple sleep modes (EM0–EM4), offering deep sleep currents as low as 1.4 μA and 87 μA/MHz active mode.
    2. High RF Performance: With up to +19 dBm TX power and a RX sensitivity of -94.1 dBm at 1 Mbps, it ensures reliable connections across different environments.
    3. Rich Peripheral Set: The module includes 32 GPIO pins, hardware crypto accelerators, and peripherals like ADC, DAC, op-amps, and timers for comprehensive functionality.
    4. Small Form Factor: At just 6.5 mm × 6.5 mm, it simplifies integration into space-constrained designs.
    Its combination of robust RF performance, small size, and rich feature set makes the BGM13S a competitive choice for developers seeking to add Bluetooth 5 connectivity with minimal engineering effort.
    Application Case Studies and Usage Recommendations
    The BGM13S is ideal for wearable devices, health monitors, industrial sensors, and smart IoT nodes. For example:
    - Health Monitoring: Embed the BGM13S in a wearable device to transmit biometric data to a smartphone app over Bluetooth 5. Use the RFSENSE capability to detect movement and trigger data transmission efficiently.
    - Smart Home Automation: Implement the module in gateway devices for reliable mesh network connectivity and deep sleep modes that extend battery life.
    Usage Tips:
    - Ensure proper RF layout per guidelines provided to maximize antenna efficiency and maintain peak gain of 1 dBi.
    - Utilize the EM0–EM4 modes effectively to minimize overall power consumption based on usage patterns.
    - Leverage the built-in security features, such as AES encryption and TRNG, to ensure secure data transmission.
    Compatibility and Support
    The BGM13S offers two antenna options: an integrated chip antenna or an RF pin for connecting external antennas. It is compatible with a wide range of tools and software provided by Silicon Labs, including the Gecko Bootloader and a comprehensive SDK. End users can access support through Silicon Labs' community forums, documentation, and direct technical assistance.
    Common Issues and Solutions
    | Issue | Solution |

    | Poor RX Sensitivity | Verify PCB layout; ensure correct antenna matching. |
    | Device Not Connecting | Check stack config

BGM13S22F512GN-V3R参数

参数
最大数据速率 2Mbps
射频系列/标准 Bluetooth
模块/芯片分类 -
典型输出功率 8dBm
典型灵敏度 102.1dBm
调制方式 GFSK
发送机数量 -
最大工作频率 -
接收机数量 -
最小工作供电电压 1.8V
最小工作频率 -
典型供电电流 -
最大工作供电电压 3.8V
接收电流 10.5mA
传输电流 8.9mA
支持协议 -
接口类型 IrDA,I²C,I²S,SPI,UART
通用封装 SMD-51P
安装方式 贴片安装
零件状态 在售
包装方式 卷带包装

BGM13S22F512GN-V3R厂商介绍

Silicon Laboratories(简称SiLabs)是一家全球领先的半导体公司,专注于开发高性能、低功耗的模拟、混合信号和无线微控制器(MCU)产品。公司成立于1996年,总部位于美国德克萨斯州奥斯汀。

SiLabs的主要产品分为以下几类:
1. 微控制器(MCU):包括EFM32、EFR32等系列,广泛应用于物联网(IoT)、智能家居、工业控制等领域。
2. 无线产品:如Zigbee、Thread、Bluetooth、Wi-Fi等无线通信模块,用于智能设备间的无线连接。
3. 模拟和混合信号产品:包括电源管理、音频、接口等芯片,服务于消费电子、医疗、汽车等行业。
4. 开发工具和软件:提供开发板、调试器和软件工具,帮助客户快速开发和测试产品。

SiLabs的优势在于:
1. 高性能:产品具有高性能、低功耗的特点,满足各种严苛的应用需求。
2. 丰富的产品线:提供多种类型的芯片和解决方案,满足不同客户的需求。
3. 强大的技术支持:提供专业的技术支持和培训,帮助客户解决技术难题。
4. 快速响应市场:紧跟市场趋势,快速推出创新产品,满足客户需求。

BGM13S22F512GN-V3R数据手册

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