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BGM210PB22JIA2R

产品分类: 蓝牙芯片
产品描述: 104.5dBm 3.8V 2Mbps ADC,GPIO,IrDA,I²C,I²S,PWM,SPI,UART 1.8V 贴片安装
供应商型号: 336-BGM210PB22JIA2RTR-ND
供应商: Digi-Key
标准整包数: 1000
SILICON LABORATORIES 蓝牙芯片 BGM210PB22JIA2R

BGM210PB22JIA2R概述

    # BGM210P Wireless Gecko Bluetooth Module: A Comprehensive Overview
    Product Introduction
    The BGM210P Wireless Gecko Bluetooth Module is a compact and versatile electronic component designed for IoT applications requiring robust wireless connectivity. This module is built upon the EFR32BG21 System-on-Chip (SoC) and offers dual-mode Bluetooth capabilities, including Bluetooth 5.x, Bluetooth Low Energy (BLE), and Bluetooth Mesh. Its primary functions revolve around enabling seamless wireless communication while maintaining optimal performance under demanding conditions. The module finds extensive use in smart homes, connected lighting systems, building automation, factory automation, and more.
    Key Functionalities:
    - Dual-mode Bluetooth connectivity (BLE & Mesh)
    - RF power levels up to +20 dBm
    - Advanced security features and regulatory compliance
    Technical Parameters
    The BGM210P boasts impressive technical specifications tailored for professional-grade IoT solutions:
    | Parameter | Value |

    | Operating Voltage | 1.71 to 3.8 V |
    | Operating Temperature | -40°C to +125°C |
    | Form Factor | 12.9 mm x 15.0 mm x 2.2 mm |
    | Tx Power Variants | +10 dBm, +20 dBm |
    | Rx Sensitivity | -104.5 dBm (125 kbps), -97.0 dBm (1 Mbps) |
    | MCU Core | 32-bit ARM Cortex-M33 @ 38.4 MHz |
    | Flash/RAM | 1024 KB Flash, 96 KB RAM |
    | Security Levels | Secure Vault Mid or High |
    Key Highlights:
    - Support for advanced Bluetooth standards such as AoA/AoD.
    - Advanced cryptographic acceleration with support for AES, ChaCha20-Poly1305, and SHA algorithms.
    - True Random Number Generator (TRNG) for enhanced security.
    Product Features and Advantages
    The BGM210P stands out due to several cutting-edge features that cater specifically to the needs of modern IoT applications:
    1. Best-in-Class Performance: Delivers superior RF range and performance with ±20 dBm TX power variants.
    2. Future-Proof Design: Equipped with a rich set of MCU peripherals, including 20 GPIOs, which ensure adaptability to evolving IoT requirements.
    3. Comprehensive Security Suite: Built with Secure Vault technology, offering robust protection against security threats and firmware updates via OTA.
    4. Low Power Consumption: Active mode consumes just 50.9 µA/MHz, making it ideal for battery-operated devices.
    Application Cases and Usage Recommendations
    The BGM210P has been successfully integrated into various real-world applications:
    - Smart Home Devices: Control lights, thermostats, and appliances via Bluetooth Mesh.
    - Industrial Automation: Streamline processes through BLE mesh networks ensuring reliable connectivity.
    - Healthcare Solutions: Enable remote patient monitoring with secure, long-range data transmission.
    Recommended Use:
    When implementing the BGM210P, ensure that the PCB layout aligns with recommended guidelines to maximize antenna efficiency. For high-power transmission scenarios, pair it with a high-efficiency power amplifier.
    Compatibility and Support
    The BGM210P is designed to work seamlessly with other modules within the Silicon Labs ecosystem. Compatible platforms include the SLWSTK6102A starter kit and the SLWRB4308 series of radio boards. Silicon Labs provides comprehensive documentation, software stacks, and development tools to aid developers in accelerating their projects.
    Common Issues and

BGM210PB22JIA2R参数

参数
支持协议 -
最大工作频率 -
最大工作供电电压 3.8V
最大数据速率 2Mbps
最小工作供电电压 1.8V
接口类型 ADC,GPIO,IrDA,I²C,I²S,PWM,SPI,UART
最小工作频率 -
ISM带宽 -
典型灵敏度 104.5dBm
范围 -
安装方式 贴片安装
零件状态 在售
包装方式 卷带包装

BGM210PB22JIA2R厂商介绍

Silicon Laboratories(简称SiLabs)是一家全球领先的半导体公司,专注于开发高性能、低功耗的模拟、混合信号和无线微控制器(MCU)产品。公司成立于1996年,总部位于美国德克萨斯州奥斯汀。

SiLabs的主要产品分为以下几类:
1. 微控制器(MCU):包括EFM32、EFR32等系列,广泛应用于物联网(IoT)、智能家居、工业控制等领域。
2. 无线产品:如Zigbee、Thread、Bluetooth、Wi-Fi等无线通信模块,用于智能设备间的无线连接。
3. 模拟和混合信号产品:包括电源管理、音频、接口等芯片,服务于消费电子、医疗、汽车等行业。
4. 开发工具和软件:提供开发板、调试器和软件工具,帮助客户快速开发和测试产品。

SiLabs的优势在于:
1. 高性能:产品具有高性能、低功耗的特点,满足各种严苛的应用需求。
2. 丰富的产品线:提供多种类型的芯片和解决方案,满足不同客户的需求。
3. 强大的技术支持:提供专业的技术支持和培训,帮助客户解决技术难题。
4. 快速响应市场:紧跟市场趋势,快速推出创新产品,满足客户需求。

BGM210PB22JIA2R数据手册

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价格梯度 中国香港交货 内地交货(含增值税)
1000+ $ 5.694 ¥ 47.6517
库存: 3000
起订量: 1000 增量: 1
交货地:
最小起订量为:1000
合计: ¥ 47651.7
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